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The Intel Hardware Feedback Interface provides guidance to the operating
system about the performance and energy efficiency capabilities of each
CPU in the system. Capabilities are numbers between 0 and 255 where a
higher number represents a higher capability. For each CPU, energy
efficiency and performance are reported as separate capabilities.
Hardware computes these capabilities based on the operating conditions of
the system such as power and thermal limits. These capabilities are shared
with the operating system in a table resident in memory. Each package in
the system has its own HFI instance. Every logical CPU in the package is
represented in the table. More than one logical CPUs may be represented in
a single table entry. When the hardware updates the table, it generates a
package-level thermal interrupt.
The size and format of the HFI table depend on the supported features and
can only be determined at runtime. To minimally initialize the HFI, parse
its features and allocate one instance per package of a data structure with
the necessary parameters to read and navigate a local copy (i.e., owned by
the driver) of individual HFI tables.
A subsequent changeset will provide per-CPU initialization and interrupt
handling.
Reviewed-by: Len Brown <len.brown@intel.com>
Co-developed by: Aubrey Li <aubrey.li@linux.intel.com>
Signed-off-by: Aubrey Li <aubrey.li@linux.intel.com>
Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Moved drivers/platform/x86/intel_menlow.c to drivers/thermal/intel.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20210816035356.1955982-1-srinivas.pandruvada@linux.intel.com
Signed-off-by: Hans de Goede <hdegoede@redhat.com>
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On Intel processors, the core frequency can be reduced below OS request,
when the current temperature reaches the TCC (Thermal Control Circuit)
activation temperature.
The default TCC activation temperature is specified by
MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an
offset in degrees C, using the TCC Offset bits in the same MSR register.
This patch introduces a cooling devices driver that utilizes the TCC
Offset feature. The bigger the current cooling state is, the lower the
effective TCC activation temperature is, so that the processors can be
throttled earlier before system critical overheats.
Note that, on different platforms, the behavior might be different on
how fast the setting takes effect, and how much the CPU frequency is
reduced.
This patch has been tested on a KabyLake mobile platform from me, and also
on a CometLake platform from Doug.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested by: Doug Smythies <dsmythies@telus.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210412125901.12549-1-rui.zhang@intel.com
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This functionality has nothing to do with MCE, move it to the thermal
framework and untangle it from MCE.
Requested-by: Peter Zijlstra <peterz@infradead.org>
Signed-off-by: Borislav Petkov <bp@suse.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://lkml.kernel.org/r/20210202121003.GD18075@zn.tnic
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This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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