thermal: int340x: processor_thermal: Refactor MMIO interface

The Processor Thermal PCI device supports multiple features. Currently
we export only RAPL. But we need more features from this device exposed
for Tiger Lake and Alder Lake based platforms. So re-structure the
current MMIO interface, so that more features can be added cleanly.

No functional changes are expected with this change.

Changes done in this patch:
- Using PCI_DEVICE_DATA(), hence names of defines changed
- Move RAPL MMIO code to its own module
- Move the RAPL MMIO offsets to RAPL MMIO module
- Adjust Kconfig dependency of PROC_THERMAL_MMIO_RAPL
- Per processor driver data now contains the supported features
- Moved all the common data structures and defines to a common header
  file
- This new header file contains all the processor_thermal_* interfaces
- Based on the features supported the module interface is called
- Each module atleast provides one add and one remove function

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201126171829.945969-1-srinivas.pandruvada@linux.intel.com

1 files changed, 72 insertions, 0 deletions

diff --git a/drivers/thermal/intel/int340x_thermal/processor_thermal_device.h b/drivers/thermal/intel/int340x_thermal/processor_thermal_device.h
new file mode 100644
index 000000000000..e20d142a55b4
--- /dev/null
+++ b/drivers/thermal/intel/int340x_thermal/processor_thermal_device.h
@@ -0,0 +1,72 @@
+/* SPDX-License-Identifier: GPL-2.0-only */
+/*
+ * processor_thermal_device.h
+ * Copyright (c) 2020, Intel Corporation.
+ */
+
+#ifndef __PROCESSOR_THERMAL_DEVICE_H__
+#define __PROCESSOR_THERMAL_DEVICE_H__
+
+#include <linux/intel_rapl.h>
+
+#define PCI_DEVICE_ID_INTEL_BDW_THERMAL	0x1603
+#define PCI_DEVICE_ID_INTEL_BSW_THERMAL	0x22DC
+
+#define PCI_DEVICE_ID_INTEL_BXT0_THERMAL	0x0A8C
+#define PCI_DEVICE_ID_INTEL_BXT1_THERMAL	0x1A8C
+#define PCI_DEVICE_ID_INTEL_BXTX_THERMAL	0x4A8C
+#define PCI_DEVICE_ID_INTEL_BXTP_THERMAL	0x5A8C
+
+#define PCI_DEVICE_ID_INTEL_CNL_THERMAL	0x5a03
+#define PCI_DEVICE_ID_INTEL_CFL_THERMAL	0x3E83
+#define PCI_DEVICE_ID_INTEL_GLK_THERMAL	0x318C
+#define PCI_DEVICE_ID_INTEL_HSB_THERMAL	0x0A03
+#define PCI_DEVICE_ID_INTEL_ICL_THERMAL	0x8a03
+#define PCI_DEVICE_ID_INTEL_JSL_THERMAL	0x4E03
+#define PCI_DEVICE_ID_INTEL_SKL_THERMAL	0x1903
+#define PCI_DEVICE_ID_INTEL_TGL_THERMAL	0x9A03
+
+struct power_config {
+	u32	index;
+	u32	min_uw;
+	u32	max_uw;
+	u32	tmin_us;
+	u32	tmax_us;
+	u32	step_uw;
+};
+
+struct proc_thermal_device {
+	struct device *dev;
+	struct acpi_device *adev;
+	struct power_config power_limits[2];
+	struct int34x_thermal_zone *int340x_zone;
+	struct intel_soc_dts_sensors *soc_dts;
+	u32 mmio_feature_mask;
+	void __iomem *mmio_base;
+};
+
+struct rapl_mmio_regs {
+	u64 reg_unit;
+	u64 regs[RAPL_DOMAIN_MAX][RAPL_DOMAIN_REG_MAX];
+	int limits[RAPL_DOMAIN_MAX];
+};
+
+#define PROC_THERMAL_FEATURE_NONE	0x00
+#define PROC_THERMAL_FEATURE_RAPL	0x01
+
+#if IS_ENABLED(CONFIG_PROC_THERMAL_MMIO_RAPL)
+int proc_thermal_rapl_add(struct pci_dev *pdev, struct proc_thermal_device *proc_priv);
+void proc_thermal_rapl_remove(void);
+#else
+static int __maybe_unused proc_thermal_rapl_add(struct pci_dev *pdev,
+						struct proc_thermal_device *proc_priv)
+{
+	return 0;
+}
+
+static void __maybe_unused proc_thermal_rapl_remove(void)
+{
+}
+#endif
+
+#endif