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2017-05-12Merge branch 'next' of ↵Linus Torvalds19-258/+1157
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Fix a problem where orderly_shutdown() is called for multiple times due to multiple critical overheating events raised in a short period by platform thermal driver. (Keerthy) - Introduce a backup thermal shutdown mechanism, which invokes kernel_power_off()/emergency_restart() directly, after orderly_shutdown() being issued for certain amount of time(specified via Kconfig). This is useful in certain conditions that userspace may be unable to power off the system in a clean manner and leaves the system in a critical state, like in the middle of driver probing phase. (Keerthy) - Introduce a new interface in thermal devfreq_cooling code so that the driver can provide more precise data regarding actual power to the thermal governor every time the power budget is calculated. (Lukasz Luba) - Introduce BCM 2835 soc thermal driver and northstar thermal driver, within a new sub-folder. (Rafał Miłecki) - Introduce DA9062/61 thermal driver. (Steve Twiss) - Remove non-DT booting on TI-SoC driver. Also add support to fetching coefficients from DT. (Keerthy) - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund) - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien, Brian Bian) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits) thermal: core: Add a back up thermal shutdown mechanism thermal: core: Allow orderly_poweroff to be called only once Thermal: Intel SoC DTS: Change interrupt request behavior trace: thermal: add another parameter 'power' to the tracing function thermal: devfreq_cooling: add new interface for direct power read thermal: devfreq_cooling: refactor code and add get_voltage function thermal: mt8173: minor mtk_thermal.c cleanups thermal: bcm2835: move to the broadcom subdirectory thermal: broadcom: ns: specify myself as MODULE_AUTHOR thermal: da9062/61: Thermal junction temperature monitoring driver Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding thermal: broadcom: add Northstar thermal driver dt-bindings: thermal: add support for Broadcom's Northstar thermal thermal: bcm2835: add thermal driver for bcm2835 SoC dt-bindings: Add thermal zone to bcm2835-thermal example thermal: rcar_gen3_thermal: add suspend and resume support thermal: rcar_gen3_thermal: store device match data in private structure thermal: rcar_gen3_thermal: enable hardware interrupts for trip points thermal: rcar_gen3_thermal: record and check number of TSCs found thermal: rcar_gen3_thermal: check that TSC exists before memory allocation ...
2017-05-06Merge branch 'thermal-soc' into nextZhang Rui16-213/+960
2017-05-06Merge branch 'linus' of ↵Zhang Rui16-213/+960
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
2017-05-05Merge branch 'backup-thermal-shutdown' into nextZhang Rui2-1/+80
2017-05-05Merge branches 'thermal-core' and 'thermal-intel' into nextZhang Rui1-3/+6
2017-05-05thermal: core: Add a back up thermal shutdown mechanismKeerthy2-0/+70
orderly_poweroff is triggered when a graceful shutdown of system is desired. This may be used in many critical states of the kernel such as when subsystems detects conditions such as critical temperature conditions. However, in certain conditions in system boot up sequences like those in the middle of driver probes being initiated, userspace will be unable to power off the system in a clean manner and leaves the system in a critical state. In cases like these, the /sbin/poweroff will return success (having forked off to attempt powering off the system. However, the system overall will fail to completely poweroff (since other modules will be probed) and the system is still functional with no userspace (since that would have shut itself off). However, there is no clean way of detecting such failure of userspace powering off the system. In such scenarios, it is necessary for a backup workqueue to be able to force a shutdown of the system when orderly shutdown is not successful after a configurable time period. Reported-by: Nishanth Menon <nm@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05thermal: core: Allow orderly_poweroff to be called only onceKeerthy1-1/+10
thermal_zone_device_check --> thermal_zone_device_update --> handle_thermal_trip --> handle_critical_trips --> orderly_poweroff The above sequence happens every 250/500 mS based on the configuration. The orderly_poweroff function is getting called every 250/500 mS. With a full fledged file system it takes at least 5-10 Seconds to power off gracefully. In that period due to the thermal_zone_device_check triggering periodically the thermal work queues bombard with orderly_poweroff calls multiple times eventually leading to failures in gracefully powering off the system. Make sure that orderly_poweroff is called only once. Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05Thermal: Intel SoC DTS: Change interrupt request behaviorBrian Bian1-3/+6
The interrupt request call in Intel SoC DTS driver may fail if there is no underlying BIOS support. However, the user space thermal daemon can still use the thermal zones created by the SoC DTS driver in polling mode, therefore, instead of bailing out on interrupt request failures, it is better just to log a warning message and continue the init process. Signed-off-by: Brian Bian <brian.bian@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05trace: thermal: add another parameter 'power' to the tracing functionLukasz Luba1-1/+1
This patch adds another parameter to the trace function: trace_thermal_power_devfreq_get_power(). In case when we call directly driver's code for the real power, we do not have static/dynamic_power values. Instead we get total power in the '*power' value. The 'static_power' and 'dynamic_power' are set to 0. Therefore, we have to trace that '*power' value in this scenario. CC: Steven Rostedt <rostedt@goodmis.org> CC: Ingo Molnar <mingo@redhat.com> CC: Zhang Rui <rui.zhang@intel.com> CC: Eduardo Valentin <edubezval@gmail.com> Acked-by: Javi Merino <javi.merino@kernel.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-05thermal: devfreq_cooling: add new interface for direct power readLukasz Luba1-23/+82
This patch introduces a new interface for device drivers connected to devfreq_cooling in the thermal framework: get_real_power(). Some devices have more sophisticated methods (like power counters) to approximate the actual power that they use. In the previous implementation we had a pre-calculated power table which was then scaled by 'utilization' ('busy_time' and 'total_time' taken from devfreq 'last_status'). With this new interface the driver can provide more precise data regarding actual power to the thermal governor every time the power budget is calculated. We then use this value and calculate the real resource utilization scaling factor. Reviewed-by: Chris Diamand <chris.diamand@arm.com> Acked-by: Javi Merino <javi.merino@kernel.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-05thermal: devfreq_cooling: refactor code and add get_voltage functionLukasz Luba1-17/+28
Move the code which gets the voltage for a given frequency. This code will be resused in few places. Acked-by: Javi Merino <javi.merino@kernel.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
2017-05-03Merge tag 'mfd-next-4.12' of ↵Linus Torvalds1-1/+1
git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd Pull MFD updates from Lee Jones: "New Drivers: - Freescale MXS Low Resolution ADC - Freescale i.MX23/i.MX28 LRADC touchscreen - Motorola CPCAP Power Button - TI LMU (Lighting Management Unit) - Atmel SMC (Static Memory Controller) New Device Support: - Add support for X-Powers AXP803 to axp20x - Add support for Dialog Semi DA9061 to da9062-core - Add support for Intel Cougar Mountain to lpc_ich - Add support for Intel Gemini Lake to lpc_ich New Functionality: - Add Device Tree support; wm831x-*, axp20x, ti-lmu, da9062, sun4i-gpadc - Add IRQ sense support; motorola-cpcap - Add ACPI support; cros_ec - Add Reset support; altera-a10sr - Add ADC support; axp20x - Add AC Power support; axp20x - Add Runtime PM support; atmel-ebi, exynos-lpass - Add Battery Power Supply support; axp20x - Add Clock support; exynos-lpass, hi655x-pmic Fix-ups: - Implicitly specify required headers; motorola-cpcap, intel_soc_pmic_bxtwc - Add .remove() method; stm32-timers, exynos-lpass - Remove unused code; intel_soc_pmic_core, intel-lpss-acpi, ipaq-micro, atmel-smc, menelaus - Rename variables for clarity; axp20x - Convert pr_warning() to pr_warn(); db8500-prcmu, sta2x11-mfd, twl4030-power - Improve formatting; arizona-core, axp20x - Use raw_spinlock_*() variants; asic3, t7l66xb, tc6393xb - Simplify/refactor code; arizona-core, atmel-ebi - Improve error checking; intel_soc_pmic_core Bug Fixes: - Ensure OMAP3630/3730 boards can successfully reboot; twl4030-power - Correct max-register value; stm32-timers - Extend timeout to account for clock stretching; cros_ec_spi - Use correct IRQ trigger type; motorola-cpcap - Fix bad use of IRQ sense register; motorola-cpcap - Logic error "||" should be "&&"; mxs-lradc-ts" * tag 'mfd-next-4.12' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (79 commits) input: touchscreen: mxs-lradc: || vs && typos dt-bindings: Add AXP803's regulator info mfd: axp20x: Support AXP803 variant dt-bindings: Add device tree binding for X-Powers AXP803 PMIC dt-bindings: Make AXP20X compatible strings one per line mfd: intel_soc_pmic_core: Fix unchecked return value mfd: menelaus: Remove obsolete local_irq_disable() and local_irq_enable() mfd: omap-usb-tll: Configure ULPIAUTOIDLE mfd: omap-usb-tll: Fix inverted bit use for USB TLL mode mfd: palmas: Fixed spelling mistake in error message mfd: lpc_ich: Add support for Intel Gemini Lake SoC mfd: hi655x: Add the clock cell to provide WiFi and Bluetooth mfd: intel_soc_pmic: Fix a mess with compilation units mfd: exynos-lpass: Add runtime PM support mfd: exynos-lpass: Add missing remove() function mfd: exynos-lpass: Add support for clocks mfd: exynos-lpass: Remove pad retention control iio: adc: add support for X-Powers AXP20X and AXP22X PMICs ADCs mfd: cpcap: Fix bad use of IRQ sense register mfd: cpcap: Use ack_invert interrupts ...
2017-04-27mfd: intel_soc_pmic: Fix a mess with compilation unitsAndy Shevchenko1-1/+1
Crystal Cove and Whiskey Cove are two different PMICs which are installed on Intel Atom SoC based platforms. Moreover there are two independent drivers that by some reason were supposed (*) to get into one kernel module. Fix the mess by clarifying Kconfig option for Crystal Cove and split Whiskey Cove out of it. (*) It looks like the configuration was never tested with INTEL_SOC_PMIC=n. The line in Makefile is actually wrong. Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI) Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com> Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-04-23thermal: mt8173: minor mtk_thermal.c cleanupsDawei Chien1-1/+1
If thermal bank with 4 sensors, thermal driver should read TEMP_MSR3. However, currently thermal driver would not read TEMP_MSR3 since mt8173 thermal driver only use 3 sensors on each thermal bank at the same time, so this patch would not effect temperature. Only if mt mt8173 thermal driver use 4 sensors on any thermal bank, would read third sensor two times, and lose fourth sensor of vale. cc: stable@vger.kernel.org Fixes: b7cf0053738c ("thermal: Add Mediatek thermal driver for mt2701.") Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com> Signed-off-by: Dawei Chien <dawei.chien@mediatek.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23thermal: bcm2835: move to the broadcom subdirectoryRafał Miłecki5-9/+9
We already have 2 Broadcom drivers and at least 1 more is coming. This made us create broadcom subdirectory where bcm2835 should be moves now. Acked-by: Florian Fainelli <f.fainelli@gmail.com> Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23thermal: broadcom: ns: specify myself as MODULE_AUTHORRafał Miłecki1-0/+1
Just in case someone uses modinfo to find (blame) me. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-15Merge back cpufreq core changes for v4.12.Rafael J. Wysocki3-118/+0
2017-04-06thermal: da9062/61: Thermal junction temperature monitoring driverSteve Twiss3-0/+326
Add junction temperature monitoring supervisor device driver, compatible with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added. If the PMIC's internal junction temperature rises above T_WARN (125 degC) an interrupt is issued. This T_WARN level is defined as the THERMAL_TRIP_HOT trip-wire inside the device driver. The thermal triggering mechanism is interrupt based and happens when the temperature rises above a given threshold level. The component cannot return an exact temperature, it only has knowledge if the temperature is above or below a given threshold value. A status bit must be polled to detect when the temperature falls below that threshold level again. A kernel work queue is configured to repeatedly poll and detect when the temperature falls below this trip-wire, between 1 and 10 second intervals (defaulting at 3 seconds). This scheme is provided as an example. It would be expected that any final implementation will also include a notify() function and any of these settings could be altered to match the application where appropriate. When over-temperature is reached, the interrupt from the DA9061/2 will be repeatedly triggered. The IRQ is therefore disabled when the first over-temperature event happens and the status bit is polled using a work-queue until it becomes false. This strategy is designed to allow the periodic transmission of uevents (HOT trip point) as the first level of temperature supervision method. It is intended for non-invasive temperature control, where the necessary measures for cooling the system down are left to the host software. Once the temperature falls again, the IRQ is re-enabled so a new critical over-temperature event can be detected. Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06thermal: broadcom: add Northstar thermal driverRafał Miłecki5-0/+120
Northstar is a SoC family commonly used in home routers. This commit adds a driver for checking CPU temperature. As Northstar Plus seems to also have this IP block this new symbol gets ARCH_BCM_IPROC dependency. Signed-off-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Jon Mason <jon.mason@broadcom.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-01thermal: bcm2835: add thermal driver for bcm2835 SoCStefan Wahren3-0/+323
Add basic thermal driver for bcm2835 SoC. This driver currently make sure that tsense HW block is set up correctly. Tested-by: Rafał Miłecki <rafal@milecki.pl> Signed-off-by: Martin Sperl <kernel@martin.sperl.org> Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Acked-by: Eric Anholt <eric@anholt.net> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: add suspend and resume supportNiklas Söderlund1-0/+35
To restore operation it's easiest to reinitialise all TSCs. In order to do this the current trip window needs to be stored in the TSC structure so that it can be restored upon resume. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: store device match data in private structureNiklas Söderlund1-3/+4
The device match data needs to be accessible outside the probe function, store it in the private data structure. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: enable hardware interrupts for trip pointsNiklas Söderlund1-1/+131
Enable hardware trip points by implementing the set_trips callback. The thermal core will take care of setting the initial trip point window and to update it once the driver reports a TSC has moved outside it. The interrupt structure for this device is a bit odd. There is not a dedicated IRQ for each TSC, instead the interrupts are shared between all TSCs. IRQn is fired if the temp monitored in IRQTEMPn is reached in any of the TSCs, example IRQ3 is fired if temperature in IRQTEMP3 is reached in either TSC0, TSC1 or TSC2. For this reason the usage of interrupts in this driver is an all-on or all-off design. When an interrupt happens all TSCs are checked and all thermal zones are updated. This could be refined to be more fine grained but the thermal core takes care of only updating the thermal zones that have left their trip point window. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: record and check number of TSCs foundNiklas Söderlund1-0/+8
Record how many TSCs are found in struct rcar_gen3_thermal_priv, this is needed to be able to add hardware interrupts for trip points later. Also add a check to make sure at least one TSC is found. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: check that TSC exists before memory allocationNiklas Söderlund1-4/+4
Move the check for a TSC resource before allocating memory for a new TSC. If no TSC is found there is little point in allocating memory for it. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: remove unneeded mutexNiklas Söderlund1-7/+0
There is no point in protecting a register read with a lock. This is most likely a leftover from when the driver was reworked before being submitted for upstream. Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-30thermal: rcar_gen3_thermal: add delay in .thermal_init on r8a7796Niklas Söderlund1-0/+2
The .thermal_init needs to be delayed a short amount of time to allow for the TEMP register to contain something useful. If it's not delayed these warnings are common during boot: thermal thermal_zone0: failed to read out thermal zone (-5) thermal thermal_zone1: failed to read out thermal zone (-5) thermal thermal_zone2: failed to read out thermal zone (-5) The warnings are triggered by the first call to .get_temp() while the TEMP register contains 0 and rcar_gen3_thermal_get_temp() returns -EIO since a TEMP value of 0 will result in a temperature reading which is out of specifications. This should have been done in the initial commit which adds the driver as the same issue was found and corrected for r8a7795. Fixes: 564e73d283af9d4c ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver") Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29thermal: ti-soc-thermal: Remove redundant codeKeerthy1-151/+3
ti_thermal_expose_sensor always takes the devm_thermal_zone_of_sensor_register call for registration with the device tree nodes present for all the bandgap sensors for omap3/4/5 and dra7 family. There are large chunks of unused code. Removing all of them. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29thermal: ti-soc-thermal: Remove redundant constantsKeerthy6-44/+0
Now that slope and offset data are being passed from device tree no need to populate in driver data. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29thermal: ti-soc-thermal: Fetch slope and offset from DTKeerthy1-2/+2
Currently slope and offset values for calculating the hot spot temperature of a thermal zone is being taken directly from driver data. So fetch them from device tree. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-16cpufreq: dbx500: Manage cooling device from cpufreq driverViresh Kumar3-118/+0
The best place to register the CPU cooling device is from the cpufreq driver as we would know if all the resources are already available or not. That's what is done for the cpufreq-dt.c driver as well. The cpu-cooling driver for dbx500 platform was just (un)registering with the thermal framework and that can be handled easily by the cpufreq driver as well and in proper sequence as well. Get rid of the cooling driver and its its users and manage everything from the cpufreq driver instead. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Tested-by: Linus Walleij <linus.walleij@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-03-13thermal: cpu_cooling: Check OPP for errorsViresh Kumar1-2/+9
It is possible for dev_pm_opp_find_freq_exact() to return errors. It was all fine earlier as dev_pm_opp_get_voltage() had a check within it to check for invalid OPPs, but dev_pm_opp_put() doesn't have any similar checks and the callers need to make sure OPP is valid before calling them. Also update the later dev_warn_ratelimited() to not print the error message as the OPP is guaranteed to be valid now. Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-13thermal: cpu_cooling: Replace dev_warn with dev_errViresh Kumar1-6/+6
There isn't much the user can do on seeing these warnings, as the hardware is actually okay. dev_err suits much better here. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-13thermal: devfreq: Check OPP for errorsViresh Kumar1-2/+8
It is possible for dev_pm_opp_find_freq_exact() to return errors. It was all fine earlier as dev_pm_opp_get_voltage() had a check within it to check for invalid OPPs, but dev_pm_opp_put() doesn't have any similar checks and the callers need to make sure OPP is valid before calling them. Also update the later dev_warn_ratelimited() to not print the error message as the OPP is guaranteed to be valid now. Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-13thermal: devfreq_cooling: Replace dev_warn with dev_errViresh Kumar1-3/+3
There isn't much the user can do on seeing this warning, as the hardware is actually okay. dev_err suits much better here. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-13thermal: devfreq: Simplify expressionViresh Kumar1-1/+1
There is no need to check for IS_ERR() as we are looking for a very particular error value here. Drop the first check. Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-13thermal: Fix potential deadlock in cpu_coolingMatthew Wilcox1-9/+11
cooling_list_lock is covering not just cpufreq_dev_count, but also the calls to cpufreq_register_notifier() and cpufreq_unregister_notifier(). Since cooling_list_lock is also used within cpufreq_thermal_notifier(), lockdep reports a potential deadlock. Fix it by testing the condition under cooling_list_lock and dropping the lock before calling cpufreq_register_notifier(). And variable cpufreq_dev_count is removed at the same time, because it's no longer needed after the fix. Fixes: ae606089621e ("thermal: convert cpu_cooling to use an IDA") Reported-and-Tested-by: Russell King <linux@armlinux.org.uk> Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com> Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-03-02sched/headers: Prepare for new header dependencies before moving code to ↵Ingo Molnar1-0/+1
<uapi/linux/sched/types.h> We are going to move scheduler ABI details to <uapi/linux/sched/types.h>, which will be used from a number of .c files. Create empty placeholder header that maps to <linux/types.h>. Include the new header in the files that are going to need it. Acked-by: Linus Torvalds <torvalds@linux-foundation.org> Cc: Mike Galbraith <efault@gmx.de> Cc: Peter Zijlstra <peterz@infradead.org> Cc: Thomas Gleixner <tglx@linutronix.de> Cc: linux-kernel@vger.kernel.org Signed-off-by: Ingo Molnar <mingo@kernel.org>
2017-03-01Merge branch 'next' of ↵Linus Torvalds16-261/+705
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - add thermal driver for R-Car Gen3 thermal sensors. - add thermal driver for ZTE' zx2967 family thermal sensors. - convert thermal ID allocation from IDR to IDA. - fix a possible NULL dereference in imx thermal driver. - fix a ti-soc-thermal driver dependency issue so that critical thermal control is still available when CPU_THERMAL is not defined. - update binding information for QorIQ thermal driver. - a couple of cleanups in thermal core, intel_powerclamp, exynos, dra752-thermal, mtk-thermal driver. * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: powerpc/mpc85xx: Update TMU device tree node for T1023/T1024 powerpc/mpc85xx: Update TMU device tree node for T1040/T1042 dt-bindings: Update QorIQ TMU thermal bindings thermal: mtk_thermal: Staticise a number of data variables thermal: arm: dra752: Remove all TSHUT related definitions thermal: arm: dra752: Remove TSHUT configuration thermal: ti-soc-thermal: Remove CPU_THERMAL Dependency from TI_THERMAL thermal: imx: Fix possible NULL dereference. thermal: exynos: Remove parsing unused samsung,tmu_cal_mode property thermal: zx2967: add thermal driver for ZTE's zx2967 family thermal: use cpumask_var_t for on-stack cpu masks dt: bindings: add documentation for zx2967 family thermal sensor thermal/intel_powerclamp: Remove set-but-not-used variables thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver thermal: rcar_gen3_thermal: Document the R-Car Gen3 thermal: convert devfreq_cooling to use an IDA thermal: convert cpu_cooling to use an IDA thermal: convert clock cooling to use an IDA thermal core: convert ID allocation to IDA
2017-02-22Merge branches 'thermal-core', 'thermal-soc', 'thermal-intel' and ↵Zhang Rui16-248/+679
'ida-conversion' into next
2017-02-21Merge branch 'linus' of ↵Zhang Rui11-57/+625
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
2017-02-20Merge branch 'pm-opp'Rafael J. Wysocki2-20/+6
* pm-opp: (24 commits) PM / OPP: Expose _of_get_opp_desc_node as dev_pm_opp API PM / OPP: Make _find_opp_table_unlocked() static PM / OPP: Update Documentation to remove RCU specific bits PM / OPP: Simplify dev_pm_opp_get_max_volt_latency() PM / OPP: Simplify _opp_set_availability() PM / OPP: Move away from RCU locking PM / OPP: Take kref from _find_opp_table() PM / OPP: Update OPP users to put reference PM / OPP: Add 'struct kref' to struct dev_pm_opp PM / OPP: Use dev_pm_opp_get_opp_table() instead of _add_opp_table() PM / OPP: Take reference of the OPP table while adding/removing OPPs PM / OPP: Return opp_table from dev_pm_opp_set_*() routines PM / OPP: Add 'struct kref' to OPP table PM / OPP: Add per OPP table mutex PM / OPP: Split out part of _add_opp_table() and _remove_opp_table() PM / OPP: Don't expose srcu_head to register notifiers PM / OPP: Rename dev_pm_opp_get_suspend_opp() and return OPP rate PM / OPP: Don't allocate OPP table from _opp_allocate() PM / OPP: Rename and split _dev_pm_opp_remove_table() PM / OPP: Add light weight _opp_free() routine ...
2017-02-18thermal: mtk_thermal: Staticise a number of data variablesVivek Gautam1-8/+8
Sparse throws following warnings: drivers/thermal/mtk_thermal.c:186:11: warning: symbol 'mt8173_bank_data' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:193:11: warning: symbol 'mt8173_msr' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:197:11: warning: symbol 'mt8173_adcpnp' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:201:11: warning: symbol 'mt8173_mux_values' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:204:11: warning: symbol 'mt2701_bank_data' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:208:11: warning: symbol 'mt2701_msr' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:212:11: warning: symbol 'mt2701_adcpnp' was not declared. Should it be static? drivers/thermal/mtk_thermal.c:216:11: warning: symbol 'mt2701_mux_values' was not declared. Should it be static? Make these variables as static to fix these warnings. Signed-off-by: Vivek Gautam <vivek.gautam@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: arm: dra752: Remove all TSHUT related definitionsKeerthy2-44/+0
No configuration needs to be done for TSHUT from software. Hence remove all the unnecessary definitions. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: arm: dra752: Remove TSHUT configurationKeerthy1-2/+1
Technical Reference Manual [1] mandates that software should not be configuring the thermal shutdown thresholds. Hence removing TSHUT_CONFIG. [1] http://www.ti.com/lit/ug/sprui30b/sprui30b.pdf Signed-off-by: Keerthy <j-keerthy@ti.com> Reported-by: Ravikumar Kattekola <rk@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: ti-soc-thermal: Remove CPU_THERMAL Dependency from TI_THERMALKeerthy1-1/+0
Currently when CPU_THERMAL is not defined the thermal sensors are not even exposed consequently no cooling is possible. CPU_THERMAL eventually depends on CPUFREQ. CPPUFREQ is not the only cooling for CPU. The thermal shutdown for critical temperatures is another cooling solution which will currently not get enabled if CPU_THERMAL is not defined. Remove this dependency so as to have the last level of thermal protection working even without CPUFREQ defined. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: imx: Fix possible NULL dereference.Shailendra Verma1-0/+4
of_device_get_match_data could return NULL, and so can cause a NULL pointer dereference later. Signed-off-by: Shailendra Verma <shailendra.v@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: exynos: Remove parsing unused samsung,tmu_cal_mode propertyKrzysztof Kozlowski2-2/+0
The property samsung,tmu_cal_mode is not used and not used. We can safely remove it. Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: zx2967: add thermal driver for ZTE's zx2967 familyBaoyou Xie3-0/+267
This patch adds thermal driver for ZTE's zx2967 family. Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org> Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-10thermal: use cpumask_var_t for on-stack cpu masksArnd Bergmann1-13/+26
Putting a bare cpumask structure on the stack produces a warning on large SMP configurations: drivers/thermal/cpu_cooling.c: In function 'cpufreq_state2power': drivers/thermal/cpu_cooling.c:644:1: warning: the frame size of 1056 bytes is larger than 1024 bytes [-Wframe-larger-than=] drivers/thermal/cpu_cooling.c: In function '__cpufreq_cooling_register': drivers/thermal/cpu_cooling.c:898:1: warning: the frame size of 1104 bytes is larger than 1024 bytes [-Wframe-larger-than=] The recommended workaround is to use cpumask_var_t, which behaves just like a normal cpu mask in most cases, but turns into a dynamic allocation when CONFIG_CPUMASK_OFFSTACK is set. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>