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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull additional thermal control update from Rafael Wysocki:
"Add Meteor Lake PCI device ID to the int340x thermal control driver
(Sumeet Pawnikar)"
* tag 'thermal-5.19-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: int340x: Add Meteor Lake PCI device ID
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Add Meteor Lake PCI ID for processor thermal device.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Add Meteor Lake ACPI IDs for DPTF devices.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a thermal library and thermal tools to wrap the netlink
interface into event-based callbacks, improve overheat condition
handling during suspend-to-idle on Intel SoCs, add some new hardware
support, fix bugs and clean up code.
Specifics:
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register()
when device_register() fails by calling
thermal_cooling_device_destroy_sysfs() (Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params
(Corentin Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver
and document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai)"
* tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits)
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
...
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull power management updates from Rafael Wysocki:
"These add support for 'artificial' Energy Models in which power
numbers for different entities may be in different scales, add support
for some new hardware, fix bugs and clean up code in multiple places.
Specifics:
- Update the Energy Model support code to allow the Energy Model to
be artificial, which means that the power values may not be on a
uniform scale with other devices providing power information, and
update the cpufreq_cooling and devfreq_cooling thermal drivers to
support artificial Energy Models (Lukasz Luba).
- Make DTPM check the Energy Model type (Lukasz Luba).
- Fix policy counter decrementation in cpufreq if Energy Model is in
use (Pierre Gondois).
- Add CPU-based scaling support to passive devfreq governor (Saravana
Kannan, Chanwoo Choi).
- Update the rk3399_dmc devfreq driver (Brian Norris).
- Export dev_pm_ops instead of suspend() and resume() in the IIO
chemical scd30 driver (Jonathan Cameron).
- Add namespace variants of EXPORT[_GPL]_SIMPLE_DEV_PM_OPS and
PM-runtime counterparts (Jonathan Cameron).
- Move symbol exports in the IIO chemical scd30 driver into the
IIO_SCD30 namespace (Jonathan Cameron).
- Avoid device PM-runtime usage count underflows (Rafael Wysocki).
- Allow dynamic debug to control printing of PM messages (David
Cohen).
- Fix some kernel-doc comments in hibernation code (Yang Li, Haowen
Bai).
- Preserve ACPI-table override during hibernation (Amadeusz
Sławiński).
- Improve support for suspend-to-RAM for PSCI OSI mode (Ulf Hansson).
- Make Intel RAPL power capping driver support the RaptorLake and
AlderLake N processors (Zhang Rui, Sumeet Pawnikar).
- Remove redundant store to value after multiply in the RAPL power
capping driver (Colin Ian King).
- Add AlderLake processor support to the intel_idle driver (Zhang
Rui).
- Fix regression leading to no genpd governor in the PSCI cpuidle
driver and fix the riscv-sbi cpuidle driver to allow a genpd
governor to be used (Ulf Hansson).
- Fix cpufreq governor clean up code to avoid using kfree() directly
to free kobject-based items (Kevin Hao).
- Prepare cpufreq for powerpc's asm/prom.h cleanup (Christophe
Leroy).
- Make intel_pstate notify frequency invariance code when no_turbo is
turned on and off (Chen Yu).
- Add Sapphire Rapids OOB mode support to intel_pstate (Srinivas
Pandruvada).
- Make cpufreq avoid unnecessary frequency updates due to mismatch
between hardware and the frequency table (Viresh Kumar).
- Make remove_cpu_dev_symlink() clear the real_cpus mask to simplify
code (Viresh Kumar).
- Rearrange cpufreq_offline() and cpufreq_remove_dev() to make the
calling convention for some driver callbacks consistent (Rafael
Wysocki).
- Avoid accessing half-initialized cpufreq policies from the show()
and store() sysfs functions (Schspa Shi).
- Rearrange cpufreq_offline() to make the calling convention for some
driver callbacks consistent (Schspa Shi).
- Update CPPC handling in cpufreq (Pierre Gondois).
- Extend dev_pm_domain_detach() doc (Krzysztof Kozlowski).
- Move genpd's time-accounting to ktime_get_mono_fast_ns() (Ulf
Hansson).
- Improve the way genpd deals with its governors (Ulf Hansson).
- Update the turbostat utility to version 2022.04.16 (Len Brown, Dan
Merillat, Sumeet Pawnikar, Zephaniah E. Loss-Cutler-Hull, Chen Yu)"
* tag 'pm-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (94 commits)
PM: domains: Trust domain-idle-states from DT to be correct by genpd
PM: domains: Measure power-on/off latencies in genpd based on a governor
PM: domains: Allocate governor data dynamically based on a genpd governor
PM: domains: Clean up some code in pm_genpd_init() and genpd_remove()
PM: domains: Fix initialization of genpd's next_wakeup
PM: domains: Fixup QoS latency measurements for IRQ safe devices in genpd
PM: domains: Measure suspend/resume latencies in genpd based on governor
PM: domains: Move the next_wakeup variable into the struct gpd_timing_data
PM: domains: Allocate gpd_timing_data dynamically based on governor
PM: domains: Skip another warning in irq_safe_dev_in_sleep_domain()
PM: domains: Rename irq_safe_dev_in_no_sleep_domain() in genpd
PM: domains: Don't check PM_QOS_FLAG_NO_POWER_OFF in genpd
PM: domains: Drop redundant code for genpd always-on governor
PM: domains: Add GENPD_FLAG_RPM_ALWAYS_ON for the always-on governor
powercap: intel_rapl: remove redundant store to value after multiply
cpufreq: CPPC: Enable dvfs_possible_from_any_cpu
cpufreq: CPPC: Enable fast_switch
ACPI: CPPC: Assume no transition latency if no PCCT
ACPI: bus: Set CPPC _OSC bits for all and when CPPC_LIB is supported
ACPI: CPPC: Check _OSC for flexible address space
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git://git.kernel.org/pub/scm/linux/kernel/git/groeck/linux-staging
Pull hwmon updates from Guenter Roeck:
"New drivers:
- Driver for the Microchip LAN966x SoC
- PMBus driver for Infineon Digital Multi-phase xdp152 family
controllers
Chip support added to existing drivers:
- asus-ec-sensors:
- Support for ROG STRIX X570-E GAMING WIFI II, PRIME X470-PRO, and
ProArt X570 Creator WIFI
- External temperature sensor support for ASUS WS X570-ACE
- nct6775:
- Support for I2C driver
- Support for ASUS PRO H410T / PRIME H410M-R /
ROG X570-E GAMING WIFI II
- lm75:
- Support for - Atmel AT30TS74
- pmbus/max16601:
- Support for MAX16602
- aquacomputer_d5next:
- Support for Aquacomputer Farbwerk
- Support for Aquacomputer Octo
- jc42:
- Support for S-34TS04A
Kernel API changes / clarifications:
- The chip parameter of with_info API is now mandatory
- New hwmon_device_register_for_thermal API call for use by the
thermal subsystem
Improvements:
- PMBus and JC42 drivers now register with thermal subsystem
- PMBus drivers now support get_voltage/set_voltage power operations
- The adt7475 driver now supports pin configuration
- The lm90 driver now supports setting extended range temperatures
configuration with a devicetree property
- The dell-smm driver now registers as cooling device
- The OCC driver delays hwmon registration until requested by
userspace
... and various other minor fixes and improvements"
* tag 'hwmon-for-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/groeck/linux-staging: (71 commits)
hwmon: (aquacomputer_d5next) Fix an error handling path in aqc_probe()
hwmon: (sl28cpld) Fix typo in comment
hwmon: (pmbus) Check PEC support before reading other registers
hwmon: (dimmtemp) Fix bitmap handling
hwmon: (lm90) enable extended range according to DTS node
dt-bindings: hwmon: lm90: add ti,extended-range-enable property
dt-bindings: hwmon: lm90: add missing ti,tmp461
hwmon: (ibmaem) Directly use ida_alloc()/free()
hwmon: Directly use ida_alloc()/free()
hwmon: (asus-ec-sensors) fix Formula VIII definition
dt-bindings: trivial-devices: Add xdp152
hwmon: (sl28cpld-hwmon) Use HWMON_CHANNEL_INFO macro
hwmon: (pwm-fan) Use HWMON_CHANNEL_INFO macro
hwmon: (peci/dimmtemp) Use HWMON_CHANNEL_INFO macro
hwmon: (peci/cputemp) Use HWMON_CHANNEL_INFO macro
hwmon: (mr75203) Use HWMON_CHANNEL_INFO macro
hwmon: (ltc2992) Use HWMON_CHANNEL_INFO macro
hwmon: (as370-hwmon) Use HWMON_CHANNEL_INFO macro
hwmon: Make chip parameter for with_info API mandatory
thermal/drivers/thermal_hwmon: Use hwmon_device_register_for_thermal()
...
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Merge int340x thermal driver updates, PCH thermal driver updates and
miscellaneous thermal control updates for 5.19-rc1:
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary)
* thermal-int340x:
thermal: int340x: Clean up _OSC context init
thermal: int340x: Consolidate freeing of acpi_buffer pointer
thermal: int340x: Clean up unnecessary acpi_buffer pointer freeing
* thermal-pch:
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
* thermal-misc:
thermal: devfreq_cooling: use local ops instead of global ops
thermal: hisi_termal: Switch from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
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Marge Energy Model support updates and cpuidle updates for 5.19-rc1:
- Update the Energy Model support code to allow the Energy Model to be
artificial, which means that the power values may not be on a uniform
scale with other devices providing power information, and update the
cpufreq_cooling and devfreq_cooling thermal drivers to support
artificial Energy Models (Lukasz Luba).
- Make DTPM check the Energy Model type (Lukasz Luba).
- Fix policy counter decrementation in cpufreq if Energy Model is in
use (Pierre Gondois).
- Add AlderLake processor support to the intel_idle driver (Zhang Rui).
- Fix regression leading to no genpd governor in the PSCI cpuidle
driver and fix the riscv-sbi cpuidle driver to allow a genpd
governor to be used (Ulf Hansson).
* pm-em:
PM: EM: Decrement policy counter
powercap: DTPM: Check for Energy Model type
thermal: cooling: Check Energy Model type in cpufreq_cooling and devfreq_cooling
Documentation: EM: Add artificial EM registration description
PM: EM: Remove old debugfs files and print all 'flags'
PM: EM: Change the order of arguments in the .active_power() callback
PM: EM: Use the new .get_cost() callback while registering EM
PM: EM: Add artificial EM flag
PM: EM: Add .get_cost() callback
* pm-cpuidle:
cpuidle: riscv-sbi: Fix code to allow a genpd governor to be used
cpuidle: psci: Fix regression leading to no genpd governor
intel_idle: Add AlderLake support
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The thermal subsystem registers a hwmon device without providing chip
information or sysfs attribute groups. While undesirable, it would be
difficult to change. On the other side, it abuses the
hwmon_device_register_with_info API by not providing that information.
Use new API specifically created for the thermal subsystem instead to
let us enforce the 'chip' parameter for other callers of
hwmon_device_register_with_info().
Acked-by: Rafael J . Wysocki <rafael@kernel.org>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
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Previously, during suspend, intel_pch_thermal driver logs for every
cooling iteration, about the current PCH temperature and number of cooling
iterations that have been tried, like below
[ 100.955526] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 1 times for 100 ms duration
[ 101.064156] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 2 times for 100 ms duration
After changing the default delay_cnt to 600, in practice, it is common to
see tens of the above messages if the system is suspended when PCH
overheats. Thus, change this log message from dev_warn to dev_dbg because
it is only useful when we want to check the temperature trend.
At the same time, there is always a one-line message given by the driver
with the patch applied, with below four possibilities.
1. PCH is cool, no cooling delay needed
[ 1791.902853] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [48C]
2. PCH overheats and becomes cool after the cooling delays
[ 1475.511617] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [49C] after 30700 ms delay
3. PCH still overheats after the overall cooling timeout
[ 2250.157487] intel_pch_thermal 0000:00:12.0: CPU-PCH is hot [60C] after 60000 ms delay. S0ix might fail
4. PCH aborts cooling because of wakeup event detected during the delay
[ 1933.639509] intel_pch_thermal 0000:00:12.0: Wakeup event detected, abort cooling
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Commit ef63b043ac86 ("thermal: intel: pch: fix S0ix failure due to PCH
temperature above threshold") introduces delay loop mechanism that allows
PCH temperature to go down below threshold during suspend so it won't
block S0ix. And the default overall delay timeout is 1 second.
However, in practice, we found that the time it takes to cool the PCH down
below threshold highly depends on the initial PCH temperature when the
delay starts, as well as the ambient temperature.
And in some cases, the 1 second delay is not sufficient. As a result, the
system stays in a shallower power state like PCx instead of S0ix, and
drains the battery power, without user' notice.
To make sure S0ix is not blocked by the PCH overheating, we
1. expand the default overall timeout to 60 seconds.
2. make sure the temperature is below threshold rather than equal to it.
At the same time, as the cooling delay can be much longer and many wakeup
events (ACPI Power Button press, USB mouse move, etc) becomes valid in the
suspend_noirq phase, add detection of wakeup event so that the driver
does not delay blindly when the system suspend is likely to abort soon.
This patch may introduce longer suspend time, but only in the cases when
the system overheats and Linux used to enter a shallower S2idle state,
say, PCx instead of S0ix.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Move the PCH Thermal driver suspend callback to suspend_noirq to do
cooling while the system is more quiescent.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455
The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.
It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.
-40C to 30C
30C to 125C
125C to 150C
With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.
Tested temperature reading on J721e SoC & J7200 SoC.
[daniel.lezcano@linaro.org: Generate look-up tables run-time]
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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of_find_node_by_name() returns a node pointer with refcount
incremented, we should use of_node_put() on it when done.
Add missing of_node_put() to avoid refcount leak.
Fixes: e20db70dba1c ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Miaoqian Lin <linmq006@gmail.com>
Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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I got memory leak as follows when doing fault injection test:
unreferenced object 0xffff888010080000 (size 264312):
comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
hex dump (first 32 bytes):
00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N..........
ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@.......
backtrace:
[<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
[<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
[<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
[<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
[<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
[<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
[<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561
If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
to free the memory allocated in thermal_cooling_device_setup_sysfs().
Fixes: 8ea229511e06 ("thermal: Add cooling device's statistics in sysfs")
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The LMh instances in the Qualcomm SC8180X platform looks to behave
similar to those in SM8150, add additional compatibles to allow
platform specific behavior to be added if needed.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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As per the latest RZ/G2L Hardware User's Manual (Rev.1.10 Apr, 2022),
the bit 31 of TSU OTP Calibration Register(OTPTSUTRIM) indicates
whether bit [11:0] of OTPTSUTRIM is valid or invalid.
This patch updates the code to reflect this change.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220428093346.7552-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add a missing s to __thermal_bind_param kernel doc comment.
This fixes the following sparse warnings:
drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Link: https://lore.kernel.org/r/20220426064113.3787826-1-clabbe@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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platform_get_resource() may return NULL, add proper check to
avoid potential NULL dereferencing.
Fixes: 250e211057c72 ("thermal: broadcom: Add Stingray thermal driver")
Signed-off-by: Zheng Yongjun <zhengyongjun3@huawei.com>
Link: https://lore.kernel.org/r/20220425092929.90412-1-zhengyongjun3@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The sensor driver which register through thermal_of interface doesn't
have an option to get thermal zone mode change notification from
thermal core.
Add support for change_mode ops in thermal_of interface so that sensor
driver can use this ops for mode change notification.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The thermal sensor on BCM2711 is capable of negative temperatures, so don't
clamp the measurements at zero. Since this was the only use for variable t,
drop it.
This change based on a patch by Dom Cobley, who also tested the fix.
Fixes: 59b781352dc4 ("thermal: Add BCM2711 thermal driver")
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220412195423.104511-1-stefan.wahren@i2se.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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On apq8064 (msm8960) platforms the tsens device is created manually by
the gcc driver. Prepare the tsens driver for the qcom,msm8960-tsens
device instantiated from the device tree.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Expose the thermal sensors on K3 AM654 as hwmon devices, so that
temperatures could be read using lm-sensors.
Signed-off-by: Massimiliano Minella <massimiliano.minella@gmail.com>
Link: https://lore.kernel.org/r/20220401151656.913166-1-massimiliano.minella@se.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add support for PMIC5 Gen2 ADC_TM, used on PMIC7 chips. It is a
close counterpart of PMIC7 ADC and has the same functionality as
PMIC5 ADC_TM, for threshold monitoring and interrupt generation.
It is present on PMK8350 alone, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
having ADC on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/1648991869-20899-5-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Refactor code to support multiple generations of ADC_TM devices
by defining gen number, irq name and disable, configure, isr and
init APIs in the individual data structs.
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/1648991869-20899-4-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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interrupt
platform_get_resource(pdev, IORESOURCE_IRQ, ..) relies on static
allocation of IRQ resources in DT core code, this causes an issue
when using hierarchical interrupt domains using "interrupts" property
in the node as this bypasses the hierarchical setup and messes up the
irq chaining.
In preparation for removal of static setup of IRQ resource from DT core
code use platform_get_irq_optional().
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220110144039.5810-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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container_of() will never return NULL, so remove useless code.
Signed-off-by: Haowen Bai <baihaowen@meizu.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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With the new OS handshake introduced by commit: "c7ff29763989 ("thermal:
int340x: Update OS policy capability handshake")", the "enabled" thermal
zone mode doesn't work in the same way as previously.
The "enabled" mode fails with -EINVAL when the new handshake is used.
To address this issue, when the new OS UUID mask is set:
- When the mode is "enabled", return 0 as the firmware already has the
latest policy mask.
- When the mode is "disabled", update the firmware with the UUID mask
of zero.
This way, the firmware can take over the thermal control.
Also reset the OS UUID mask, which allows user space to update with new
set of policies.
Fixes: c7ff29763989 ("thermal: int340x: Update OS policy capability handshake")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Changelog edits, removed unneeded parens ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Merge a fix for the attr.show callback prototype in the int340x thermal
driver (Kees Cook).
* thermal-int340x:
thermal: int340x: Fix attr.show callback prototype
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The userspace governor is still in use on production systems and the
deprecating warning is scary.
Even if we want to get rid of the userspace governor, it is too soon
yet as the alternatives are not yet adopted.
Change the deprecated warning by an information message suggesting to
switch to the netlink thermal events.
Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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This reverts commit a67a46af4ad6342378e332b7420c1d1a2818c53f.
It has been reported the warning is annoying as the cooling device
state is still needed on some production system.
Meanwhile we provide a way to consolidate the thermal framework to
prevent multiple actors acting on the cooling devices with conflicting
decisions, let's revert this warning.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Control Flow Integrity (CFI) instrumentation of the kernel noticed that
the caller, dev_attr_show(), and the callback, odvp_show(), did not have
matching function prototypes, which would cause a CFI exception to be
raised. Correct the prototype by using struct device_attribute instead
of struct kobj_attribute.
Reported-and-tested-by: Joao Moreira <joao@overdrivepizza.com>
Link: https://lore.kernel.org/lkml/067ce8bd4c3968054509831fa2347f4f@overdrivepizza.com/
Fixes: 006f006f1e5c ("thermal/int340x_thermal: Export OEM vendor variables")
Cc: 5.8+ <stable@vger.kernel.org> # 5.8+
Signed-off-by: Kees Cook <keescook@chromium.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Fix access illegal address problem in following condition:
There are multiple devfreq cooling devices in system, some of them has
EM model but others do not. Energy model ops such as state2power will
append to global devfreq_cooling_ops when the cooling device with
EM model is registered. It makes the cooling device without EM model
also use devfreq_cooling_ops after appending when registered later by
of_devfreq_cooling_register_power() or of_devfreq_cooling_register().
The IPA governor regards the cooling devices without EM model as a power
actor, because they also have energy model ops, and will access illegal
address at dfc->em_pd when execute cdev->ops->get_requested_power,
cdev->ops->state2power or cdev->ops->power2state.
Fixes: 615510fe13bd2 ("thermal: devfreq_cooling: remove old power model and use EM")
Cc: 5.13+ <stable@vger.kernel.org> # 5.13+
Signed-off-by: Kant Fan <kant@allwinnertech.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Cleaning up the driver to use pm_sleep_ptr() macro instead of #ifdef
guards is simpler and allows the compiler to remove those functions
if built without CONFIG_PM_SLEEP support.
Signed-off-by: Hesham Almatary <hesham.almatary@huawei.com>
Reviewed-by: Paul Cercueil <paul@crapouillou.net>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The Energy Model can now be artificial, which means the power values
are mathematically generated to leverage EAS while not expected to be on
an uniform scale with other devices providing power information. If this
EM type is in use, the thermal governor IPA should not be allowed to
operate, since the relation between cooling devices is not properly
defined. Thus, it might be possible that big GPU has lower power values
than a Little CPU. To mitigate a misbehaviour of the thermal control
algorithm, simply do not register the cooling device as IPA's power
actor.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Ionela Voinescu <ionela.voinescu@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Now that the UUID is already sanitized by the caller,
lets trivially clean up some of the context arming.
Signed-off-by: Davidlohr Bueso <dave@stgolabs.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Introduce a single point of freeing/exit after ensuring no error in
int3400_setup_gddv().
Signed-off-by: Davidlohr Bueso <dave@stgolabs.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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It is the caller's responsibility to free only upon ACPI_SUCCESS.
Signed-off-by: Davidlohr Bueso <dave@stgolabs.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
[ rjw: Subject edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Merge Intel Hardware Feedback Interface (HFI) thermal driver for
5.18-rc1 and update the intel-speed-select utility to support that
driver.
* thermal-hfi:
tools/power/x86/intel-speed-select: v1.12 release
tools/power/x86/intel-speed-select: HFI support
tools/power/x86/intel-speed-select: OOB daemon mode
thermal: intel: hfi: INTEL_HFI_THERMAL depends on NET
thermal: netlink: Fix parameter type of thermal_genl_cpu_capability_event() stub
thermal: intel: hfi: Notify user space for HFI events
thermal: netlink: Add a new event to notify CPU capabilities change
thermal: intel: hfi: Enable notification interrupt
thermal: intel: hfi: Handle CPU hotplug events
thermal: intel: hfi: Minimally initialize the Hardware Feedback Interface
x86/cpu: Add definitions for the Intel Hardware Feedback Interface
x86/Documentation: Describe the Intel Hardware Feedback Interface
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Merge powerclamp thermal driver changes, int340x thermal driver changes
and thermal documentation changes for 5.18-rc1:
- Don't use bitmap_weight() in end_power_clamp() in the powerclamp
driver (Yury Norov).
- Update the OS policy capabilities handshake in the int340x thermal
driver (Srinivas Pandruvada).
- Increase the policies bitmap size in int340x (Srinivas Pandruvada).
- Replace acpi_bus_get_device() with acpi_fetch_acpi_dev() in the
int340x thermal driver (Rafael Wysocki).
- Check for NULL after calling kmemdup() in int340x (Jiasheng Jiang).
- Add Intel Dynamic Power and Thermal Framework (DPTF) kernel interface
documentation (Srinivas Pandruvada).
- Fix bullet list warning in the thermal documentation (Randy Dunlap).
* thermal-powerclamp:
thermal: intel_powerclamp: don't use bitmap_weight() in end_power_clamp()
* thermal-int340x:
thermal: int340x: Update OS policy capability handshake
thermal: int340x: Increase bitmap size
thermal: Replace acpi_bus_get_device()
thermal: int340x: Check for NULL after calling kmemdup()
* thermal-docs:
Documentation: thermal: DPTF Documentation
thermal: fix Documentation bullet list warning
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Update the firmware with OS supported policies mask, so that firmware can
relinquish its internal controls. Without this update several Tiger Lake
laptops gets performance limited with in few seconds of executing in
turbo region.
The existing way of enumerating firmware policies via IDSP method and
selecting policy by directly writing those policy UUIDS via _OSC method
is not supported in newer generation of hardware.
There is a new UUID "B23BA85D-C8B7-3542-88DE-8DE2FFCFD698" is defined for
updating policy capabilities. As part of ACPI _OSC method:
Arg0 - UUID: B23BA85D-C8B7-3542-88DE-8DE2FFCFD698
Arg1 - Rev ID: 1
Arg2 - Count: 2
Arg3 - Capability buffers: Array of Arg2 DWORDS
DWORD1: As defined in the ACPI 5.0 Specification
- Bit 0: Query Flag
- Bits 1-3: Always 0
- Bits 4-31: Reserved
DWORD2 and beyond:
- Bit0: set to 1 to indicate Intel(R) Dynamic Tuning is active, 0 to
indicate it is disabled and legacy thermal mechanism should
be enabled.
- Bit1: set to 1 to indicate Intel(R) Dynamic Tuning is controlling
active cooling, 0 to indicate bios shall enable legacy thermal
zone with active trip point.
- Bit2: set to 1 to indicate Intel(R) Dynamic Tuning is controlling
passive cooling, 0 to indicate bios shall enable legacy thermal
zone with passive trip point.
- Bit3: set to 1 to indicate Intel(R) Dynamic Tuning is handling
critical trip point, 0 to indicate bios shall enable legacy
thermal zone with critical trip point.
- Bits 4:31: Reserved
From sysfs interface, there is an existing interface to update policy
UUID using attribute "current_uuid". User space can write the same UUID
for ACTIVE, PASSIVE and CRITICAL policy. Driver converts these UUIDs to
DWORD2 Bit 1 to Bit 3. When any of the policy is activated by user
space it is assumed that dynamic tuning is active.
For example
$cd /sys/bus/platform/devices/INTC1040:00/uuids
To support active policy
$echo "3A95C389-E4B8-4629-A526-C52C88626BAE" > current_uuid
To support passive policy
$echo "42A441D6-AE6A-462b-A84B-4A8CE79027D3" > current_uuid
To support critical policy
$echo "97C68AE7-15FA-499c-B8C9-5DA81D606E0A" > current_uuid
To check all the supported policies
$cat current_uuid
3A95C389-E4B8-4629-A526-C52C88626BAE
42A441D6-AE6A-462b-A84B-4A8CE79027D3
97C68AE7-15FA-499c-B8C9-5DA81D606E0A
To match the bit format for DWORD2, rearranged enum int3400_thermal_uuid
and int3400_thermal_uuids[] by swapping current INT3400_THERMAL_ACTIVE
and INT3400_THERMAL_PASSIVE_1.
If the policies are enumerated via IDSP method then legacy method is
used, if not the new method is used to update policy support.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The number of policies are 10, so can't be supported by the bitmap size
of u8.
Even though there are no platfoms with these many policies, but
for correctness increase to u32.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Fixes: 16fc8eca1975 ("thermal/int340x_thermal: Add additional UUIDs")
Cc: 5.1+ <stable@vger.kernel.org> # 5.1+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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commit b263b473bf62 ("thermal: ti-soc-thermal: Remove redundant code")
left behind this, remove it.
Signed-off-by: YueHaibing <yuehaibing@huawei.com>
Reviewed-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20220305125047.26948-1-yuehaibing@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Utilize platform_get_irq_optional() to silence these messages:
brcmstb_thermal a581500.thermal: IRQ index 0 not found
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220301181412.2008044-1-f.fainelli@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The return value from tegra_bpmp_transfer indicates the success or
failure of the IPC transaction with BPMP. If the transaction
succeeded, we also need to check the actual command's result code.
Add code to do this.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20210915085517.1669675-1-mperttunen@nvidia.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Expose ti-soc-thermal thermal sensors as HWMON devices.
# sensors
cpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)
dspeve_thermal-virtual-0
Adapter: Virtual device
temp1: +51.4 C (crit = +105.0 C)
gpu_thermal-virtual-0
Adapter: Virtual device
temp1: +54.2 C (crit = +105.0 C)
iva_thermal-virtual-0
Adapter: Virtual device
temp1: +54.6 C (crit = +105.0 C)
core_thermal-virtual-0
Adapter: Virtual device
temp1: +52.6 C (crit = +105.0 C)
Similar to imx_sc_thermal d2bc4dd91da6095a769fdc9bc519d3be7ad5f97a.
No need to take care of thermal_remove_hwmon_sysfs() since
devm_thermal_add_hwmon_sysfs() (a wrapper around devres) is
used. See c7fc403e40b0ea18976a59e968c23439a80809e8.
Signed-off-by: Romain Naour <romain.naour@smile.fr>
Link: https://lore.kernel.org/r/20220218104725.2718904-1-romain.naour@smile.fr
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add compatible to support LMh for sm8150 SoC.
sm8150 does not require explicit enabling for various LMh subsystems.
Add a variable indicating the same as match data which is set for sdm845.
Execute the piece of code enabling various LMh subsystems only if
enable algorithm match data is present.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220106173138.411097-2-thara.gopinath@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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