diff options
| author | Anton Tikhomirov <av.tikhomirov@samsung.com> | 2012-02-15 17:04:56 +0900 |
|---|---|---|
| committer | Felipe Balbi <balbi@ti.com> | 2012-03-02 12:11:28 +0200 |
| commit | d28a9689c93195d39f91f35a9519876688605b65 (patch) | |
| tree | 39d7c0b3f80657039cefc3996c20010bdbabbed0 /drivers/usb/dwc3/Makefile | |
| parent | f6bafc6a1c9d58f0c234ac5052b9c09b0747348c (diff) | |
| download | linux-d28a9689c93195d39f91f35a9519876688605b65.tar.bz2 | |
usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.
[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]
Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'drivers/usb/dwc3/Makefile')
| -rw-r--r-- | drivers/usb/dwc3/Makefile | 13 |
1 files changed, 13 insertions, 0 deletions
diff --git a/drivers/usb/dwc3/Makefile b/drivers/usb/dwc3/Makefile index 900ae74357f1..d441fe4c180b 100644 --- a/drivers/usb/dwc3/Makefile +++ b/drivers/usb/dwc3/Makefile @@ -28,6 +28,19 @@ endif obj-$(CONFIG_USB_DWC3) += dwc3-omap.o +## +# REVISIT Samsung Exynos platform needs the clk API which isn't +# defined on all architectures. If we allow dwc3-exynos.c compile +# always we will fail the linking phase on those architectures +# which don't provide clk api implementation and that's unnaceptable. +# +# When Samsung's platform start supporting pm_runtime, this check +# for HAVE_CLK should be removed. +## +ifneq ($(CONFIG_HAVE_CLK),) + obj-$(CONFIG_USB_DWC3) += dwc3-exynos.o +endif + ifneq ($(CONFIG_PCI),) obj-$(CONFIG_USB_DWC3) += dwc3-pci.o endif |