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authorLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
committerLen Brown <len.brown@intel.com>2012-10-09 01:35:52 -0400
commit29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch)
tree8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /drivers/hwmon/Kconfig
parent125c4c706b680c7831f0966ff873c1ad0354ec25 (diff)
parentc072fed95c9855a920c114d7fa3351f0f54ea06e (diff)
downloadlinux-29b19e250434c6193c8b8e4c34c9c6284dd4f101.tar.bz2
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'drivers/hwmon/Kconfig')
-rw-r--r--drivers/hwmon/Kconfig10
1 files changed, 0 insertions, 10 deletions
diff --git a/drivers/hwmon/Kconfig b/drivers/hwmon/Kconfig
index c74e73b2069a..c4633de64465 100644
--- a/drivers/hwmon/Kconfig
+++ b/drivers/hwmon/Kconfig
@@ -334,16 +334,6 @@ config SENSORS_DA9052_ADC
This driver can also be built as module. If so, the module
will be called da9052-hwmon.
-config SENSORS_EXYNOS4_TMU
- tristate "Temperature sensor on Samsung EXYNOS4"
- depends on ARCH_EXYNOS4
- help
- If you say yes here you get support for TMU (Thermal Management
- Unit) on SAMSUNG EXYNOS4 series of SoC.
-
- This driver can also be built as a module. If so, the module
- will be called exynos4-tmu.
-
config SENSORS_I5K_AMB
tristate "FB-DIMM AMB temperature sensor on Intel 5000 series chipsets"
depends on PCI