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path: root/drivers/thermal/ti-soc-thermal/dra752-bandgap.h
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2019-06-05treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 336Thomas Gleixner1-15/+1
Based on 1 normalized pattern(s): this program is free software you can redistribute it and or modify it under the terms of the gnu general public license version 2 as published by the free software foundation this program is distributed in the hope that it will be useful but without any warranty without even the implied warranty of merchantability or fitness for a particular purpose see the gnu general public license for more details you should have received a copy of the gnu general public license along with this program if not write to the free software foundation inc 51 franklin st fifth floor boston ma 02110 1301 usa extracted by the scancode license scanner the SPDX license identifier GPL-2.0-only has been chosen to replace the boilerplate/reference in 246 file(s). Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Alexios Zavras <alexios.zavras@intel.com> Reviewed-by: Allison Randal <allison@lohutok.net> Cc: linux-spdx@vger.kernel.org Link: https://lkml.kernel.org/r/20190530000436.674189849@linutronix.de Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2018-07-27thermal: ti-soc-thermal: remove dead codeBartlomiej Zolnierkiewicz1-68/+0
Majority of this code (i.e. functions from ti-bandgap.c) has been introduced in May 2013 by commit eb982001dbd8 ("thermal: introduce TI SoC thermal driver"). Just remove it altogether (in case it is needed it can be easily resurrected from git repo). While at it fix incorrect "not used" comments. Tested-by: Keerthy <j-keerthy@ti.com> Acked-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18thermal: arm: dra752: Remove all TSHUT related definitionsKeerthy1-19/+0
No configuration needs to be done for TSHUT from software. Hence remove all the unnecessary definitions. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2013-06-13thermal: ti-soc-thermal: add thermal data for DRA752 chipsEduardo Valentin1-0/+280
This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>